Details

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UNICOMP LX9200 – Inline High-Precision 3D X-Ray Inspection System

Model: LX9200

Brand: UNICOMP

Product Type: Inline 2D / 2.5D / 3D X-Ray Inspection System

Application: Automated non-destructive X-ray inspection for PCB, PCBA, BGA, semiconductor packages and advanced electronic assemblies

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Overview

The UNICOMP LX9200 is a high-precision inline X-ray inspection system designed for automated inspection of complex electronic assemblies and semiconductor components.

Combining 2D, 2.5D and 3D X-ray inspection in one platform, the system enables manufacturers to inspect hidden solder joints, internal structures and defects that cannot be reliably detected through conventional optical inspection.

The LX9200 incorporates a 130 kV closed micro-focus X-ray source, high-definition flat-panel detector and an 11-axis linkage system to support multi-directional and multi-angle inspection. Its 360° circular CT imaging capability provides enhanced analysis of complex solder joints and internal component structures.

Designed for integration into electronics production environments, the system also incorporates data tracking and rework functions to support production quality control and defect traceability.

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Applications

• SMT and PCBA production

• Electronics manufacturing services (EMS)

• BGA inspection

• LGA inspection

• CSP and POP package inspection

• SIP package inspection

• Flip-chip inspection

• Semiconductor package inspection

• IC and wire-bond inspection

• LED manufacturing

• IGBT inspection

• Battery component inspection

• Solder-joint quality analysis

• Automated production-line quality control

Typical defects that can be inspected include:

• Solder voids

• Head-in-pillow (HIP) defects

• Insufficient solder

• Solder bridging

• Open connections

• Short circuits

• Solder-ball defects

• Internal package abnormalities

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Key Features

• Integrated 2D, 2.5D and 3D X-ray inspection

• High-precision inline automatic inspection

• 130 kV closed micro-focus X-ray source

• High-definition flat-panel detector (FPD)

• Multiple selectable resolutions up to 6 µm

• 11-axis linkage system for flexible inspection positioning

• Multi-directional and multi-angle inspection

• 360° circular CT imaging

• Real-time X-ray image acquisition

• Suitable for complex BGA, CSP, semiconductor and PCBA inspection

• Automatic inspection for production-line quality control

• Embedded data-tracking system

• Embedded rework-management function

• PCBA warpage compensation up to ±2 mm

• Multiple inspection-area configurations available

• Designed for advanced electronics and semiconductor manufacturing

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Technical Specifications

Parameter	Specification
Model	LX9200
Equipment Type	Inline X-Ray Inspection System
Inspection Technology	2D / 2.5D / 3D
X-Ray Tube Type	Closed Micro-Focus
Maximum X-Ray Voltage	130 kV
Detector	HD Flat Panel Detector (FPD)
Maximum Resolution	Up to 6 µm
CT Capability	360° Circular CT Imaging
Motion System	11-Axis Linkage System
Image Acquisition	2D / 2.5D / 3D
Max. Inspection Area – M Size	255 × 330 mm
Max. Inspection Area – L Size	440 × 550 mm
Max. Inspection Area – XL Size	610 × 1200 mm
PCBA Thickness	0.5–5 mm
PCBA Craft Side	5 mm
PCBA Warpage Compensation	±2 mm
Top Clearance	70 mm
Bottom Clearance	40 mm
Machine Dimensions	1640(W) × 2070(D) × 1800(H) mm
Machine Weight	Approx. 3450 kg
Power Supply	220 VAC / 50 Hz
Power Consumption	Approx. 5.5 kW
X-Ray Leakage	<0.5 µSv/h*
Applications	SMT, EMS, BGA, CSP, LED, Flip Chip, Semiconductor, Battery, IGBT
Data System	Embedded Data Tracking & Rework System
Certification	CE, FDA

The manufacturer's webpage shows <0.5 µSv/h in its detailed technical table, while another section of the same page states <1 µSv/h. Final radiation-leakage specification should therefore be confirmed against the official Unicomp quotation or datasheet before contractual submission.

Specifications may be updated or configured according to the selected system size and final project requirements.

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Available Configurations

M Size

Maximum inspection area:

255 × 330 mm

Suitable for smaller PCBAs and electronic assemblies where compact inspection coverage is required.

L Size

Maximum inspection area:

440 × 550 mm

Suitable for medium-to-large PCBAs and general electronics production.

XL Size

Maximum inspection area:

610 × 1200 mm

Designed for larger PCB assemblies and applications requiring extended inspection coverage.

Final configuration should be selected according to:

• Maximum PCB / PCBA dimensions

• Component height

• Required inspection resolution

• Inspection cycle-time requirement

• Production-line layout

• Product mix

• Defect-detection requirements

• Upstream and downstream production equipment

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Typical Inspection Capability

SMT / PCBA

Suitable for package types including:

• BGA

• LGA

• CSP

• POP

• SIP

Typical inspection targets include:

• Voids

• Head-in-pillow defects

• Insufficient solder

• Solder bridges

• Hidden solder-joint abnormalities

Semiconductor

Suitable for applications including:

• Wire bonding

• Integrated circuits

• Flip chip

• Semiconductor packages

Typical defects include:

• Voids

• Open circuits

• Short circuits

• Wire sweep

• Solder-ball defects

Other Applications

The LX9200 can also support inspection requirements for:

• IGBT components

• Battery-related products

• Advanced electronic assemblies

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Why Choose Us

UNICOMP

UNICOMP develops industrial X-ray inspection technologies for electronics, semiconductor and other manufacturing applications.

The LX9200 combines high-resolution X-ray imaging, multi-axis positioning and 3D inspection capabilities in an inline platform designed for automated production inspection.

Its combination of 2D, 2.5D and 3D imaging allows manufacturers to use one system for both routine production inspection and more detailed analysis of complex internal structures.

LX9200 Inline 3D X-Ray Inspection System

The LX9200 is particularly suitable for manufacturers that require more than conventional 2D X-ray inspection.

Its 11-axis motion system and 360° CT capability allow complex electronic assemblies to be inspected from multiple angles, while the high-definition FPD and micro-focus X-ray source provide detailed imaging of hidden solder joints and internal structures.

Integrated data-tracking and rework functions further support traceability and production quality management.

Redmark Industry

Redmark provides local consultation and technical coordination for industrial X-ray inspection projects in Malaysia.

Support can include application review, sample and defect evaluation, model selection, production-line requirement discussion, installation coordination, operator training and after-sales technical support.

For inline X-ray projects, Redmark can also work with the customer and manufacturer to review PCB dimensions, inspection targets, production throughput and line-integration requirements before final system selection.

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How the UNICOMP LX9200 Works